Reference tables, Q.P.I. Ruler

qpi_ruler_h4

Minimal Via Size
Increase 20°C/ACu 18µmCu 35µm
0,50A0,15mm0,15mm
0,75A0,20mm0,15mm
1,00A0,30mm0,15mm
1,30A0,45mm0,20mm
1,50A0,55mm0,25mm
1,80A0,70mm0,35mm
2,00A0,80mm0,40mm
2,50A0,95mm0,55mm
3,00A1,45mm0,70mm
5,00A2,90mm1,50mm

 

Cu PatternOuter layers
Standard/AdvancedCu 18µmCu 35µmCu 70µm
PAD2PAD90µm / 75µm100µm / 90µm215µm / 200µm
TRACK2PAD90µm / 75µm100µm / 90µm215µm / 200µm
TRACK2TRACK100µm / 90µm115µm / 110µm230µm / 215µm
TRACK WIDTH100µm / 90µm115µm / 110µm150µm / 140µm
TEXT WIDTH150µm / 125µm150µm / 125µm150µm / 125µm

 

Cu PatternInner layers
Standard/AdvancedCu 18µmCu 35µmCu 70µm
PAD2PAD80µm / 70µm90µm / 75µm165µm / 140µm
TRACK2PAD80µm / 70µm90µm / 75µm165µm / 140µm
TRACK2TRACK90µm / 75µm100µm / 90µm180µm / 250µm
TRACK WIDTH90µm / 75µm100µm / 90µm150µm / 125µm

 

Drills
LayerFeatureStandardAdvanced
BOTHVia Annular Ring100µm finished75µm finished
BOTHPTH Annual Rng150µm finished125µm finished
PTHAspect Ratio12:116:1
BLIND VIAAspect Ratio1:10,8:1
INNERPTH2Cu200µm 150µm

 

Profile
LayerFeatureStandardAdvanced
BOTHProfile2Cu200µm150µm
BOTHOutline tolerance± 0,15mm± 0,10mm
OUTERScore2Cu 
(centre of score line to copper)
800µm600µm

 

Solder Mask

StandardAdvanced
Encroachment100µm75µm
Web(dam)100µm75µm
Annular ring1:11:1

 

Silk Screen

StandardAdvanced
Encroachment125µm100µm
Web(dam)125µm100µm
Annular ring1:11:1

 

Surface Treatment
Immersion AgImmersion Silver0,2  - 0,4 µm
OSPOrganic passivation0,1  - 0,3 µm
ENIGNiAuNi 3 - 8 µm, Au 0,05 - 0,1 µm
ENEPIGNiPdAuNi 3 - 8 µm, Pd 0,05 - 0,15 µm, Au 0,05 - 0,1 µm
Hard GoldConnector GoldNi >3 µm, Au 0,1 - 1,5 µm

 

standard-lay-out1

hdi-lay-out

 

 

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Q.P.I. Group B.V.