Via covering/sealing

Q.P.I. Design strategy and recommendations with regard to the protection of through via holes in Printed Circuit Boards (PCBs). Q.P.I. bulletin Via hole protection.

IPC Via covering / sealing options
Via covering/sealing
Description
Covering material
Application
ipc4761-v
Filled
Plugging epoxy (non-conductive)
  • Protection of solder floating up to the component side
  • Saving space
  • Enables stacked and staggered micovias
  • Enables Via-in-Pad technology
  • Preferred option
  • Filled and capped most reliable and durable option
ipc4761-viaFilled and covered one-side
Plugging epoxy + LPI Solder stop
ipc4761-vibFilled and covered both-sides
Plugging epoxy + LPI Solder stop
ipc4761-viiFilled and capped
Plugging epoxy + plating
ipc4761-iiia
Plugged one-side
Plugging epoxy (non-conductive)
  • Protection of solder floating up to the component side
  • Enables use of vacuum during assembly
ipc4761-iiibPlugged both-sides 
Plugging epoxy (non-conductive)
ipc4761-ivaPlugged and covered one-side
Plugging epoxy + LPI solder stop
ipc4761-ivbPlugged and covered both-sides
Plugging epoxy + LPI solder stop
ipc4761-ia
Tented one-side
Dryfilm solder stop
  • Protection of solder floating up to the component side
  • Enables use of vacuum during assembly
  • Covering critical via, p.e. close to BGAs
ipc4761-ib
Tented both-sides 
Dryfilm solder stop
ipc4761-iiaTented and covered one-side
Dryfilm solder stop + LPI solder stop
ipc4761-iibTented and covered both-sides
Dryfilm solder stop + LPI solder stop
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Q.P.I. Group B.V.
Q.P.I. Group B.V.